## current distribution

https://doi.org/10.1351/goldbook.C01456
The ratio of @[email protected] at a point X on an @[email protected] to the @[email protected] ($$\frac{j_{\text{x}}}{j}$$) is called the @[email protected] The current distribution is described by the function $$\frac{j_{\text{x}}}{j} = f(x)$$ (or more generally, $$\frac{j_{\text{x}}}{j} = f(x,\,y,\,z)$$ where $$x$$ or $$(x,\,y,\,z)$$ are the coordinates of the points of the electrode-solution @[email protected] The @[email protected] is that which establishes itself when the influence of @[email protected] is negligible. The @[email protected] is that which establishes itself when the influence of the @[email protected] cannot be neglected but @[email protected] is negligible. The secondary distribution is often described in terms of dimensionless numbers of the form $\mathrm{Wa}=\frac{\kappa }{l}\ \frac{\mathrm{d}\eta }{\mathrm{d}j}$ where $$\kappa$$ is the @[email protected] of the solution, $$\frac{\text{d}\eta }{\text{d}j}$$ the slope of the @[email protected] curve under the above conditions and $$l$$ a characteristic length of the system, for instance the radius of a disc electrode. $$\mathrm{Wa}$$ is the @[email protected] It is a quantity which determines the @[email protected] and characterizes the equalizing influence of @[email protected] on the current distribution. In electroplating the @[email protected] is qualitatively defined as 'the ability of a solution to deposit metal uniformly upon a @[email protected] of irregular shape'. The @[email protected] is that which establishes itself when the influence of the @[email protected] (including @[email protected]) cannot be neglected.
Source:
PAC, 1981, 53, 1827. (Nomenclature for transport phenomena in electrolytic systems) on page 1836 [Terms] [Paper]